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Solder Paste
SOLDER PASTE
Lead-free Solder paste
PRODUCT SELECTION
DETAILED INTRODUCTION
PRODUCT LIST

Features and Benefits:

·  High reliability and low voiding .

·  Excellent solderability:  solve the poor solder wetting problems of some important Pb-free  components, eg. CSP, QFN etc.; Good solderability on various lead-free board / component finishes, including OSP, HASL, ENIG. 

·  Outstanding printability: long stencil life - 12 hours with continuous and consistently  printing.

·  Print speeds of up to 150mm/s, enabling a fast print cycle time and a high throughput.

·  Wide reflow profile window: reflowable in air or nitrogen, enables high quality solderability of complicated, high density PWB assemblies.

·  Excellent solder and flux cosmetics after reflow soldering.


Application

PCB assembly, including smartphone, Tablet PC, motherboards,  consumer electronics, web server, Automobile electrical system, and equipments of medical, military or aerospace etc.

PRODUCT LIST
Alloy
Size
Features&Application
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu Type3(45~25);Type4(38~20) CSP Excellent wetting properties,Heat resistance
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu Type3(45~25);Type4(38~20) Wide reflow profile window, Tiny pitch for home appliances, vehicle etc
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu Type3(45~25);Type4(38~20) /
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu Type3(45~25);Type4(38~20) Good fluidity,Excellent solderability
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu Type3(45~25);Type4(38~20) Highly active product
42Sn-58Bi;64Sn-1Ag-Bi35;64.7Sn-0.3Ag-Bi35 Type3(45~25);Type4(38~20) Low-melting point, high reliability For LED products
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